Bernstein Wafer Tweezer 12 mm Jaw With Graduated Lower Paddle and 4 Teeth 4 DWF With ESD vendor_PACE controlled-feed solder/wire holder (for standard-sized

controlled-feed solder/wire holder (for standard-sized spools)

Overall Dimensions: 690 x 535 x 370mm

Packed in storage display wallet

Safety CAT III

For deburring and filing angles and inner corners

Bernstein Wafer Tweezer 12 mm Jaw With Graduated Lower Paddle and 4 Teeth 4 DWF With ESD vendor_PACE controlled-feed solder/wire holder (for standard-sizedOverview For positioning of flat and fine components, e. g. extremely sensitive and breakable wafer (Glass wafer etc.) fine PCB's and LCD's very smooth and non reflective surface high grade steel SA, anti magnetic. Specifications Brand Bernstein Product Type Wafer Tweezer Length 130 mm Weight 17 g Special Features With graduated lower paddle and 4 teeth 4 DWF With ESD Coating For Wafer Size 3 in Jaw Size 12 mm Resources Product Brochure