Tin And Solder Plating In Thesemiconductor Industry ( 1993rd Edition) Subclass_MARKETING COMMUNICATION Mudah diikuti

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Tin And Solder Plating In Thesemiconductor Industry ( 1993rd Edition) Subclass_MARKETING COMMUNICATION Mudah diikutiThe object of this book is to provide balanced coverage of the theory and practice of plating semiconductor devices. The principal concepts of plating are introduced and best practice discussed. The book is designed to help electroplaters achieve `zero defect' plating by providing an understanding of the plating chemistry and the handling of the plated parts. Dimensions : 6. 14 x 0. 81 x 9. 21 inches